Etch stop in a damascene interconnect structure

ABSTRACT

An interconnect structure with a plurality of low dielectric constant insulating layers acting as etch stops is disclosed. The low dielectric constant materials act as insulating layers through which trenches and vias are subsequently formed by employing a timed etching. Since the low dielectric constant materials are selected so that the etchant available for each one has only a small etch rate relative to the other low dielectric constant materials, the plurality of low dielectric constant materials act as etch stops during the fabrication of interconnect structures. This way, the etch stop layers employed in the prior art are eliminated and the number of fabrication steps is reduced.

FIELD OF THE INVENTION

The present invention relates to semiconductor devices and methods ofmaking such devices. More particularly, the invention relates to amethod of providing an etch stop in damascene interconnect structures.

BACKGROUND OF THE INVENTION

The integration of a large number of components on a single integratedcircuit (IC) chip requires complex interconnects. Ideally, theinterconnect structures should be fabricated with minimal signal delayand optimal packing density. The reliability and performance ofintegrated circuits may be affected by the qualities of theirinterconnect structures.

Advanced multiple metallization layers have been used to accommodatehigher packing densities as devices shrink below sub-0.25 micron designrules. One such metallization scheme is a dual damascene structureformed by a dual damascene process. The dual damascene process is atwo-step sequential mask/etch process to form a two-level structure,such as a via connected to a metal line situated above the via.

As illustrated in FIG. 1, a known dual damascene process begins with thedeposition of a first insulating layer 14 over a first levelinterconnect metal layer 12, which in turn is formed over or within asemiconductor substrate 10. A second insulating layer 16 is next formedover the first insulating layer 14. An etch stop layer 15 is typicallyformed between the first and second insulating layers 14, 16. The secondinsulating layer 16 is patterned by photolithography with a first mask(not shown) to form a trench 17 corresponding to a metal line of asecond level interconnect. The etch stop layer 15 prevents the upperlevel trench pattern 17 from being etched through to the firstinsulating layer 14.

As illustrated in FIG. 2, a second masking step followed by an etch stepare applied to form a via 18 through the etch stop layer 15 and thefirst insulating layer 14. After the etching is completed, both thetrench 17 and the via 18 are filled with metal 20, which is typicallycopper (Cu), to form a damascene structure 25, as illustrated in FIG. 3.If desired, a second etch stop layer, such as stop layer 29 of FIG. 4,may be formed between the substrate 10 and the first insulating layer 14during the formation of a dual damascene structure 26.

Damascene processes such as the ones described above pose significantproblems. One of the problems is caused by the use of one or more etchstop layers. The etch stop layers 15, 25 prevent the damascene patterns17, 18 from extending into or through the underlying layers 14, 10.Although the advantages of using the etch stop layers are significant,the process is complex since separate depositions are required for theetch stop layers.

In addition, the most commonly used etch stop material, silicon nitride(Si₃N₄), has a rather high dielectric constant (k) (approximately 7),which does not satisfy anymore the requirement of resistance-capacitancedelay regarding the parasitic capacitance generated by an intermetalinsulating layer. As integrated circuits become denser, it isincreasingly important to minimize stray capacitance between the metallayers. This is accomplished by using intermetal insulating layers thathave a low dielectric constant, such as, for example, organic dielectricmaterials. Silicon nitride does not satisfy the requirement of smallstray capacitance of advanced damascene structures.

Accordingly, there is a need for an improved damascene process whichreduces production costs and increases productivity. There is also aneed for a damascene process that does not require etch stop layers, aswell as a method for decreasing the stray capacitance between the metallayers of damascene structures.

SUMMARY OF THE INVENTION

The present invention provides a method for fabricating a damascenemultilevel interconnect structure in a semiconductor device. Accordingto one aspect of the invention, the use of high dielectric etch stopmaterial may be avoided, so as to reduce or minimize stray capacitance.

In an exemplary embodiment, a plurality of low dielectric constantmaterials are selected with similar methods of formation, as well aswith similar capacities to withstand physical and thermal stress. Thelow dielectric constant materials act as insulating layers through whichtrenches and vias are subsequently formed by employing a timed etching.Since the low dielectric constant materials are selected so that theetchant available for each one has only a small etch rate relative tothe other low dielectric constant materials, the plurality of lowdielectric constant materials act as etch stops during the fabricationof damascene structures. This way, the etch stop layers employed in theprior art are eliminated and the number of fabrication steps is reduced.

Additional advantages of the present invention will be more apparentfrom the detailed description and accompanying drawings, whichillustrate preferred embodiments of the invention.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a cross sectional view of a semiconductor device at apreliminary stage of production.

FIG. 2 is a cross sectional view of the semiconductor device of FIG. 1at a subsequent stage of production.

FIG. 3 is a cross sectional view of the semiconductor device of FIG. 2at a subsequent stage of production.

FIG. 4 is a cross sectional view of another semiconductor device.

FIG. 5 is a cross sectional view of a semiconductor device at apreliminary stage of production and in accordance with a method of thepresent invention.

FIG. 6 is a cross sectional view of the semiconductor device of FIG. 5at a subsequent stage of production.

FIG. 7 is a cross sectional view of the semiconductor device of FIG. 6at a subsequent stage of production.

FIG. 8 is a cross sectional view of the semiconductor device of FIG. 7at a subsequent stage of production.

FIG. 9 is a cross sectional view of the semiconductor device of FIG. 8at a subsequent stage of production.

FIG. 10 is a cross sectional view of the semiconductor device of FIG. 9at a subsequent stage of production.

FIG. 11 is a cross sectional view of the semiconductor device of FIG. 10at a subsequent stage of production.

FIG. 12 is a cross sectional view of the semiconductor device of FIG. 11at a subsequent stage of production.

FIG. 13 is a cross sectional view of the semiconductor device of FIG. 12at a subsequent stage of production.

FIG. 14 is a cross sectional view of the semiconductor device of FIG. 13at a subsequent stage of production.

FIG. 15 is a cross sectional view of the semiconductor device of FIG. 14at a subsequent stage of production.

FIG. 16 is a cross sectional view of the semiconductor device of FIG. 15at a subsequent stage of production.

FIG. 17 is a cross sectional view of the semiconductor device of FIG. 16at a subsequent stage of production.

FIG. 18 is a cross sectional view of the semiconductor device of FIG. 17at a subsequent stage of production.

FIG. 19 is a cross sectional view of a semiconductor device of FIG. 18at a subsequent stage of production.

FIG. 20 is a cross sectional view of a semiconductor device of FIG. 19at a subsequent stage of production.

FIG. 21 is a cross sectional view of a semiconductor device of FIG. 20at a subsequent stage of production.

FIG. 22 is a cross sectional view of a semiconductor device of FIG. 21at a subsequent stage of production.

FIG. 23 is a cross sectional view of a semiconductor device of FIG. 22at a subsequent stage of production.

FIG. 24 illustrates a computer system having a memory cell with a dualdamascene structure according to the present invention.

DETAILED DESCRIPTION OF PREFERRED EMBODIMENTS

In the following detailed description, reference is made to variousspecific embodiments in which the invention may be practiced. Theseembodiments are described with sufficient detail to enable those skilledin the art to practice the invention, and it is to be understood thatother embodiments may be employed, and that structural and electricalchanges may be made without departing from the spirit or scope of thepresent invention.

The term “substrate” used in the following description may include anysemiconductor-based structure that has a semiconductor surface. The termshould be understood to include silicon, silicon-on insulator (SOI),silicon-on sapphire (SOS), doped and undoped semiconductors, epitaxiallayers of silicon supported by a base semiconductor foundation, andother semiconductor structures. The semiconductor need not besilicon-based. The semiconductor could be silicon-germanium, germanium,or gallium arsenide. When reference is made to a “substrate” in thefollowing description, previous process steps may have been utilized toform regions or junctions in or on the base semiconductor or foundation.

The term “metal” is intended to include not only elemental metal, butalso metal with other trace metals or in various alloyed combinationswith other metals as known in the art, as long as such alloy retains thephysical and chemical properties of the metal.

The present invention provides a method for fabricating a damasceneinterconnect structure in which a plurality of low dielectric constantmaterials are selected with similar methods of formation, as well aswith similar capacities to withstand physical and thermal stress, andthrough which metallization trenches and vias are formed by employing atimed etching.

Referring now to the drawings, where like elements are designated bylike reference numerals, FIG. 5 depicts a portion of a semiconductorsubstrate 50 on or within which a conducting layer 52 has been formed.The conducting layer 52 represents a lower metal interconnect layer ordevice level which is to be later interconnected with an upper metalinterconnect layer. The conducting layer 52 may be formed of copper(Cu), but other conductive materials, such as tungsten (W) silver (Ag)gold (Au) or aluminum (Al) and their alloys, may be used also.

Referring now to FIG. 6, a first intermetal insulating layer 55 isformed overlying the substrate 50 and the conducting layer 52. In apreferred embodiment of the present invention, the first intermetalinsulating layer 55 is blanket deposited by spin coating to a thicknessof about 4,000 Angstroms to 30,000 Angstroms, more preferably about12,000 to 20,000 Angstroms. The first intermetal insulating layer 55 maybe cured at a predefined temperature, depending on the nature of thematerial. Other known deposition methods, such as sputtering by chemicalvapor deposition (CVD), plasma enhanced CVD (PECVD), or physical vapordeposition (PVD), may be used also for the formation of the firstintermetal insulating layer 55, as desired. The first intermetalinsulating layer 55 is desirably selected so that the etchant for thislayer does not attack the underlying substrate material to any greatextent.

The first intermetal insulating layer 55 may be formed of a lowdielectric constant organic material such as, for example, polyimide,spin-on-polymers (SOP), flare, polyarylethers, parylene,polytetrafluoroethylene, benzocyclobutene (BCB) or SILK. Alternatively,the first intermetal insulating layer 55 may be formed of an inorganicmaterial with a low dielectric constant such as, for example,fluorinated silicon oxide (FSG), hydrogen silsesquioxane (HSQ) orNANOGLASS. The present invention is not limited, however, to theabove-listed materials and other organic and inorganic materials withlow dielectric constant may be used, especially ones whose dielectricconstant (k) is lower than that of silicon oxide (SiO₂), which isapproximately 4.0.

Next, as illustrated in FIG. 7, a thin second intermetal insulatinglayer 57 is formed overlying the first intermetal insulating layer 55and below a metal layer that will be formed subsequently. The thinsecond intermetal insulating layer 57 may be formed, for example, byspin coating to a thickness of about 100 Angstroms to about 2,000Angstroms, more preferably of about 500 Angstroms. Following deposition,the second intermetal insulating layer 57 is cured at a predefinedtemperature, depending, again, on the nature and specificcharacteristics of the insulating material. Other deposition methods,such as the ones mentioned above with reference to the formation of thefirst intermetal insulating layer 55, may be used also.

The material of choice for the second intermetal insulating layer 57 isalso a low dielectric constant organic or inorganic material, with adielectric constant lower than 4.0, as the ones listed above withreference to the first intermetal insulating layer 55. However, asdiscussed in more detail below, the two insulating layers 55, 57 arepreferably compatible with each other in the sense that each of them maybe capable of withstanding stress levels which will be later induced asa result of various processes and during the use of the IC device.Further, each material should be capable of withstanding the maximumtemperature required in the processing of the other one.

In a preferred embodiment of the present invention, two compatiblematerials for the two intermetal insulating layers 55, 57 are SILK(organic material with k of approximately 2.65 at 100 kHz) and NANOGLASS(inorganic material with k of approximately 3.5 at 100 kHz). Both SILKand NANOGLASS can be applied by spin coating and both are capable ofwithstanding similar stress levels, as well as the processingtemperature of each other. Further, both SILK and NANOGLASS may beindividually etched by a respective etchant which, while readily etchingone insulating material, will have only a very small, negligible etchrate for the other insulating material.

Another example of two compatible low dielectric constant materials is afoamed polyimide (as the organic component with k in the range of 2.0 to3.0, depending upon the degree of porosity) and hydrogen silsesquioxane(HSQ) (as the inorganic component with k in the range of 2.3 to 3.0).However, other combinations may also be employed. Further, two,lowdielectric constant organic materials, as well as two low dielectricconstant inorganic materials may be used also, as long as both materialsretain compatible physical and chemical properties. Thus, the presentinvention is not limited to the use of the above-mentioned combinations,and other compatible low dielectric constant materials may be used also,especially those whose dielectric constants are lower than 4.0.

Referring now to FIG. 8, a first photoresist layer 58 is formed over thesecond intermetal insulating layer 57. The first photoresist layer 58 isthen patterned with a mask (not shown) having images of trench patterns59 (FIG. 8). Thus, trenches 65 may be formed, as shown in FIG. 9, byetching through the photoresist layer 58 and into the second intermetalinsulating layer 57 by using a second etchant. The second etchant may beselected in accordance with the characteristics of the second insulatingmaterial 57. The second etchant (not shown) selectively etches thesecond insulating material 57 until it reaches the first insulatingmaterial 55. In the preferred embodiment of the present invention, whichemploys the SILK/NANOGLASS combination, the second etchant (for etchingthrough the second intermetal insulating NANOGLASS layer 57) may containa chlorine (Cl) plasma. The first etchant (which will selectively etchthe first intermetal insulating SILK layer 55) may employ oxygen (O₂)plasma.

After the formation of trenches 65 through the first intermetalinsulating layer 55 and the removal of the first photoresist layer 58,vias 56 (FIG. 13) may be formed by photolithography. As such, a secondphotoresist layer 67 (FIG. 10) is formed over the first and secondintermetal insulating layers 55, 57, and then patterned with a mask (notshown) having images of via patterns 63 (FIG. 10). The via patterns 63are then etched by employing a timed etch into the second intermetalinsulating layer 57 to form vias 56 (FIG. 11).

The etching of vias 56 is accomplished by employing a time etching witha first etchant (which may include an O₂ plasma) to etch part of thefirst intermetal insulating layer 55, for example about half of thefirst insulating layer 55, to obtain vias 56 a, as shown in FIG. 11.Subsequent to the formation of vias 56 a, the second photoresist layer67 is removed so that the first etchant is further used to completelyetch through the first intermetal insulating layer 55 and complete theformation of vias 56 (FIG. 13) and define the trenches in layer 55, withthe pattern, etched previously, in level 57 serving as a mask, see FIG.13.

Next, a barrier layer, if needed, 72 (FIG. 14) is formed on the vias 56and the trenches 65, as well as over the second intermetal insulatinglayer 57 by CVD, PVD, sputtering or evaporation, to a thickness of about50 Angstroms to about 200 Angstroms, more preferably of about 100Angstroms. Preferred materials for the barrier layer 72 are metals suchas titanium (Ti), zirconium (Zr), tungsten (W), or hafnium (Hf), ormetal compounds such as tantalum nitride (TaN), which may be applied byblanket deposition. If desired, the barrier layer 72 may be formed ofrefractory metal silicides such as TiSi or ZrSi. In any event, thebarrier layer 72 suppresses the diffusion of the metal atoms from thesubsequently deposited conductive material (FIG. 14), while offering alow resistivity and low contact resistance between the metal of themetal layer 52 and the barrier layer 72, and between the subsequentlydeposited conductive material (FIG. 14) and the barrier layer 72. Asknown in the art, the material for the barrier layer 72 is selectedaccording to the type of metallurgy and/or insulators employed.

As also illustrated in FIG. 14, a conductive material 80 is nextdeposited to fill in both vias 56 and trenches 65. In the preferredembodiment, the conductive material 80 comprises either copper,tungsten, aluminum, gold, silver or aluminum-copper and their alloys,but it must be understood that other materials may be used also. In anyevent, the conductive material 80 may be blanket deposited by a knownPVD, CVD, or a combination of these techniques to fill in both vias 56and trenches 65. Alternatively, the conductive material 80 may bedeposited by a plating technique.

If necessary, a second barrier layer may be deposited on top of theconductive material 80. For example, in the case of aluminum oraluminum-copper alloy structures, a layer of titanium (Ti) or zirconium(Zr) is often used both above and below the aluminum alloy layer toimprove electromigration resistance of the lines. In any event, afterthe deposition of the conductive material 80, excess metal formed abovethe surface of the second insulating material 57 may be removed byeither an etching or a polishing technique to form first metallizationstructures 81 illustrated in FIG. 15. In a preferred embodiment of thepresent invention, chemical mechanical polishing (CMP) is used to polishaway excess conductive material above the second insulating material 57and the trench level. This way, the second insulating material 57 actsas a polishing stop layer when CMP is used.

Subsequent the formation of the first metallization structures 81 (FIG.15), a second timed etch is employed to complete the process of forminga second damascene interconnect structure 100 (FIG. 23). As such, asecond pair of intermetal insulating layers of low dielectric constantmaterials is formed over the first and second intermetal insulatinglayers 55, 57. In an exemplary embodiment of the invention, the secondpair of intermetal insulating layers includes same low dielectricconstant materials as those forming the first and second intermetalinsulating layers 55, 57. For example, in the SILK/NANOGLASS combinationdescribed above, the second pair of intermetal insulating layers willcomprise first a layer of NANOGLASS and then a layer of SILK. Thisembodiment is exemplified in more detail below.

Accordingly, as illustrated in FIG. 16, a third intermetal insulatinglayer 57 a is formed overlying the first metallization structures 81 andportions of the second intermetal insulating layer 57. In a preferredembodiment of the present invention, the third intermetal insulatinglayer 57 a is formed of a low dielectric constant material similar tothat of the second intermetal insulating layer 57. Thus, in theexemplary embodiment of the invention which employs the SILK/NANOGLASScombination described above, the third intermetal insulating layer 57 amay be formed of NANOGLASS and may be blanket deposited by spin coatingto a thickness of about 4,000 Angstroms to 30,000 Angstroms, more topreferably about 12,000 to 20,000 Angstroms. The third intermetalinsulating layer 57 a may be also cured at a predefined temperature,depending on the nature of the material.

Next, as illustrated in FIG. 17, a thin fourth intermetal insulatinglayer 55 a is formed overlying the third intermetal insulating layer 57a. The thin fourth intermetal insulating layer 55 a may be formed, forexample, by spin coating to a thickness of about 100 Angstroms to about2,000 Angstroms, more preferably of about 500 Angstroms. Followingdeposition, the fourth intermetal insulating layer 55 a is cured at apredefined temperature, depending, again, on the nature and specificcharacteristics of the insulating material. Other deposition methods,such as the ones mentioned above with reference to the formation of theintermetal insulating layers 55, 57, 57 a may be used also.

The material of choice for the fourth intermetal insulating layer 57 ais also a low dielectric constant organic or inorganic material, with adielectric constant lower than 4.0, as the ones listed above withreference to the first and second intermetal insulating layers 55, 57.For example, in the exemplary embodiment of the invention which employsthe SILK/NANOGLASS combination described above, the fourth intermetalinsulating layer 55 a may be formed of SILK, which is the material ofchoice for the first insulating layer 55.

Subsequent to the formation of the third and fourth intermetalinsulating layers 57 a, 55 a, the processing steps for the formation ofa second metallization structure 83 (FIG. 23) proceed according to thosedescribed above with reference to the formation of the firstmetallization structure 81 (FIGS. 8-15). As such, a third photoresistlayer 68 (FIG. 17) is formed over the fourth intermetal insulating layer55 a, and then patterned with a mask (not shown) having images of atrench pattern 69 (FIG. 17). Thus, a pattern of the trench 85 may beformed, as shown in FIG. 18, by etching through the photoresist layer 68and into the fourth intermetal insulating layer 55 a. The etching may beaccomplished by employing the first etchant previously used for theetching of vias 56 (FIG. 13) through the first intermetal insulatinglayer 55. For example, in the preferred embodiment of the presentinvention which employs the SILK/NANOGLASS combination, the firstetchant for selectively etching the first and fourth intermetalinsulating SILK layers 55, 57 may employ oxygen (O₂) plasma.

After the formation of a pattern of the trench 85 through the fourthintermetal insulating layer 55 a and the removal of the thirdphotoresist layer 68, vias 76 (FIG. 21) may be formed byphotolithography, in ways similar to those for the formation of vias 56(FIGS. 10-13). Accordingly, a fourth photoresist layer 77 (FIG. 19) isformed over the third and fourth intermetal insulating layers 57 a, 55 aand then patterned with a mask (not shown) having images of via patterns73 (FIG. 19). The via patterns 73 are then etched by employing a secondtime etching into the third intermetal insulating layer 57 a to formvias 76 of FIG. 20.

The etching of vias 76 is accomplished by employing a time etching withthe second etchant (which may include a chlorine plasma) to etch part ofthe third intermetal insulating layer 57 a, for example about half ofthe third insulating layer 57 a, to obtain vias 76 a, as shown in FIG.20. Subsequent to the formation of vias 76 a, the fourth photoresistlayer 77 is removed so that the second etchant is further used tocompletely etch through the third intermetal insulating layer 57 a andcomplete the formation of vias 76 (FIG. 21) and define the trenches inlayer 57 a.

A barrier layer 74 is next formed on the vias 76 and the thirdintermetal insulating layer 57 a, as shown in FIG. 22. The barrier layer74 may be formed by CVD, PVD, sputtering or evaporation, to a thicknessof about 50 Angstroms to about 200 Angstroms, more preferably of about100 Angstroms. Preferred materials for the barrier layer 74 are metalssuch as titanium (Ti), zirconium (Zr), tungsten (W), or hafnium (Hf),metal compounds such as tantalum nitride (TaN), refractory metalsilicides such as titanium silicide (TiSi) or zirconium silicide (ZrSi),among others.

Referring now to FIG. 22, a conductive material 82 is deposited to fillin both vias 76 and trench 85. The conductive material 82 may be formedof copper, aluminum, or tungsten, among others, and may be deposited orplated, depending on the desired method of formation. In any event,excess metal formed above the surface of the fourth intermetalinsulating layer 55 a is removed by either an etching or a polishingtechnique to form a second metallization structure 83 (FIG. 23) and tocomplete the formation of a damascene interconnect structure 100illustrated in FIG. 23. In a preferred embodiment of the presentinvention, chemical mechanical polishing (CMP) is used to polish awayexcess conductive material above the fourth insulating material 55 a andthe trench level. This way, the fourth insulating material 55 a acts asa polishing stop layer when CMP is used.

Although only two damascene interconnect structures 100 are shown inFIG. 23, it must be readily apparent to those skilled in the art that infact any number of such damascene interconnect structures may be formedon the substrate 50. Further, although the exemplary embodimentdescribed above refers to only two pairs of low dielectric constantinsulating layers, it must be understood that any number of such pairsmay be employed, depending on the desired level of metallization.

Also, although the exemplary embodiment described above refers to theformation of a damascene interconnect structure 100, the invention isfurther applicable to other types of metallization structures, forexample, single, double or triple damascene structures, or subtractivemetallization structures, depending on the number of low dielectricconstant insulating layers formed over the substrate 50. Further, theinvention is not limited to the use of SILK and NANOGLASS, but may beused with other compatible organic and/or inorganic materials withdielectric constants lower than 4.0.

In addition, further steps to create a functional memory cell may becarried out. Thus, additional multilevel interconnect layers andassociated dielectric layers could be formed to create operativeelectrical paths from the damascene interconnect structure 100 to asource/drain region (not shown) of the substrate 50.

A typical processor-based system 400 which includes a memory circuit448, for example a DRAM, containing interconnect structures according tothe present invention is illustrated in FIG. 24. A processor system,such as a computer system, generally comprises a central processing unit(CPU) 444, such as a microprocessor, a digital signal processor, orother programmable digital logic devices, which communicates with aninput/output (I/O) device 446 over a bus 452. The memory 448communicates with the system over bus 452.

In the case of a computer system, the processor system may includeperipheral devices such as a floppy disk drive 454 and a compact disk(CD) ROM drive 456 which also communicate with CPU 444 over the bus 452.Memory 448 is preferably constructed as an integrated circuit, whichincludes one or more damascene interconnect structures 100. If desired,the memory 448 may be combined with the processor, e.g. CPU 444, in asingle integrated circuit.

The above description and drawings are only to be consideredillustrative of exemplary embodiments which achieve the features andadvantages of the present invention. Modification and substitutions tospecific process conditions and structures can be made without departingfrom the spirit and scope of the present invention. Accordingly, theinvention is not to be considered as being limited by the foregoingdescription and drawings, but is only limited by the scope of theappended claims.

1. A method of forming an interconnect structure, said method comprisingthe steps of: forming a second opening through a second insulating layerwhich is provided over a first insulating layer, said first and secondinsulating layers comprising a low dielectric constant material; timeetching a first opening through said first insulating layer, said firstopening being in communication with said second opening; and providing afirst conductive material in said first and second openings. 2-75.(canceled)
 76. An integrated circuit structure comprising: a firstinsulating layer with a dielectric constant lower than 4.0 provided overa semiconductor substrate and contacting at least a portion of a metallayer provided within the semiconductor substrate; a second insulatinglayer with a dielectric constant lower than 4.0 provided over the firstinsulating layer; and at least a first opening within the firstinsulating layer, the first opening having a first portion with a firstwidth and a second portion with a second width, the first width beingdifferent from the second width, wherein the first insulating layercomprises a material which is not affected by a first maximumtemperature for processing of the second insulating layer and the secondinsulating layer comprises a material which is not affected by a secondmaximum temperature for processing of the first insulating layer. 77.The integrated circuit structure of claim 76, wherein the firstinsulating material comprises foamed polyimide and wherein the secondinsulating material comprises hydrogen silsesquioxane.
 78. Theintegrated circuit structure of claim 76, wherein at least one of thefirst and second insulating layers comprise an organic material.
 79. Theintegrated circuit structure of claim 76, wherein at least one of thefirst and second insulating layers comprise an inorganic material. 80.The integrated circuit structure of claim 78, wherein the organicmaterial comprises one of polyimide, spin-on-polymers, flarepolyarylethers, parylene, polytetrafluoroethylene, benzocyclobutene andSILK.
 81. The integrated circuit structure of claim 79, wherein theinorganic material comprises one of fluorinated silicon oxide, hydrogensilsesquioxane and NANOGLASS.
 82. An integrated circuit structurecomprising: a first insulating layer with a dielectric constant lowerthan 4.0 provided over a semiconductor substrate and contacting at leasta portion of a metal layer provided within the semiconductor substrate;a second insulating layer with a dielectric constant lower than 4.0provided over the first insulating layer; and at least a first openingwithin the first insulating layer, the first opening having a firstportion with a first width and a second portion with a second width, thefirst width being different from the second width, wherein the firstinsulating layer comprises a material which may be etched by a firstetchant which has negligible etching rate on the substrate and thesecond insulating layer comprises a material which may be etched by asecond etchant which has a negligible etching rate on the firstinsulating layer.
 83. The integrated circuit structure of claim 82,wherein at least one of the first and second insulating layers comprisean organic material.
 84. The integrated circuit structure of claim 82,wherein at least one of the first and second insulating layers comprisean inorganic material.
 85. The integrated circuit structure of claim 83,wherein the organic material comprises one of polyimide,spin-on-polymers, flare polyarylethers, parylene,polytetrafluoroethylene, benzocyclobutene and SILK.
 86. The integratedcircuit structure of claim 84, wherein the inorganic material comprisesone of fluorinated silicon oxide, hydrogen silsesquioxane and NANOGLASS.87. An integrated circuit structure comprising: a first insulating layercomprising foamed polyimide provided over a semiconductor substrate andcontacting at least a portion of a metal layer provided within thesemiconductor substrate; a second insulating layer comprising hydrogensilsesquioxane provided over the first insulating layer; and at least afirst opening within the first insulating layer, the first openinghaving a first portion with a first width and a second portion with asecond width, the first width being different from the second width. 88.The integrated circuit structure of claim 87, further comprising: athird insulating layer and a fourth insulating layer, each with adielectric constant lower than 4.0 provided over the second insulatinglayer; and at least a second opening within the third and forthinsulating layers, the second opening having a third portion with athird width and a fourth portion with a fourth width, the third widthbeing different from the fourth width
 89. The integrated circuitstructure of claim 88, wherein the third insulating layer comprises amaterial which may be etched by a first etchant which has negligibleetching rate on the second insulating layer and the fourth insulatinglayer comprises a material which may be etched by a second etchant whichhas a negligible etching rate on the third insulating layer.
 90. Theintegrated circuit structure of claim 88, wherein the third insulatinglayer comprises a material which is not affected by a first maximumtemperature for processing of the fourth insulating layer and the fourthinsulating layer comprises a material which is not affected by a secondmaximum temperature for processing of the third insulating layer andwherein the foamed polyimide and the hydrogen silsesquioxane are notaffected by either the first maximum temperature or the second maximumtemperature.
 91. The integrated circuit structure of claim 88, whereinat least one of the third and fourth insulating layers comprise anorganic material.
 92. The integrated circuit structure of claim 88,wherein at least one of the third and fourth insulating layers comprisean inorganic material.
 93. The integrated circuit structure of claim 91,wherein the organic material comprises one of polyimide,spin-on-polymers, flare polyarylethers, parylene,polytetrafluoroethylene, benzocyclobutene and SILK.
 94. The integratedcircuit structure of claim 92, wherein the inorganic material comprisesone of fluorinated silicon oxide, hydrogen silsesquioxane and NANOGLASS.